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Working principle of non-destructive testing equipment
Every industry has some effective auxiliary tools, and in the electronics industry, non-destructive testing equipment is one of them. Since the BGA microcontroller chip is not distributed around it according to the traditional design, but distributed at the bottom of the microcontroller chip, it is undoubtedly impossible to judge the quality of the solder joints based on traditional manual visual inspection, so it must be tested based on ICT or even function. Therefore, non-destructive testing equipment is increasingly used in SMT post-reflow inspection. It can not only qualitatively analyze solder joints, but also detect and correct faults in a timely manner.
Working principle of nondestructive testing equipment.
1. First of all, non-destructive devices mainly use the penetrating power of X-rays. X-rays have a short wavelength and high energy. When a substance irradiates an object, it will only absorb a small part of the X-rays, while most of the energy of the X-rays will pass through the gaps between the atoms of the substance, showing strong penetrating power.
2. The non-destructive device can detect the relationship between X-ray penetration and material density, and can distinguish materials of different densities through differential absorption. In this way, if the detected object has different thickness, shape changes, different X-ray absorption and different images, different black and white images will be produced.
3. It can be used for IGBT semiconductor testing, BGA chip testing, LED light bar testing, PCB bare board testing, lithium battery testing, and non-destructive testing of aluminum castings.
4. Simply put, use non-destructive micro-focus non-destructive equipment to output high-quality fluorescent perspective images, which are then converted into signals received by flat-panel detectors. All functions of the operating software are completed with only a mouse, which is easy to use. Standard high-performance X-ray tubes can detect defects below 5 microns, and some non-destructive equipment can detect defects below 2.5 microns. The system can be magnified 1000 times and the object can be tilted. Non-destructive equipment can be detected manually or automatically, and the detection data can be automatically generated.
News
2024/01/09
