Industry News
Application of X-ray Technology in BGA Testing
In the 1990s, with the advancement of integration technology and the improvement of equipment, LSI, VLSI, and ULSI appeared one after another. The integration of silicon single chips continued to increase, the requirements for integrated circuit packaging became more stringent, the number of I/O pins increased sharply, and power consumption also increased. In order to meet the needs of development, a new variety was added on the basis of the original packaging varieties - ball grid array package, referred to as BGA (Ball Grid Array Package).
At present, the commonly used inspection methods of BGA include: visual inspection, flying probe electronic test, X-ray inspection, dyeing inspection and slice inspection. Among them, X-ray inspection uses the transmission characteristics of X-rays to well detect the welding of solder balls hidden under the device, which is currently the most effective BGA welding quality inspection method.
The following are several core advantages of X-ray inspection:
Non-destructive testing : X-ray testing is a non-destructive testing method that does not require physical contact or damage to the object being tested. This is very important for sensitive electronic components such as BGA chips, as they will not be subject to additional damage or influence.
Internal structure visible : X-rays can penetrate objects and display their internal structure. For BGA chips, X-rays can penetrate the external package and display the quality and reliability of the solder joint connection. This enables X-ray inspection to detect defects, cracks, cold solder joints and other problems in solder joints.
High resolution : Modern X-ray inspection equipment has high resolution capabilities that can show tiny details and defects. This is very important for inspecting the quality of tiny solder joints in BGA chips, as these solder joints are often very small and difficult to observe directly.
Fast and automated : X-ray inspection equipment usually has the ability to quickly scan and process images, which can complete a large number of inspection tasks in a short time. In addition, some equipment also has automation functions, which can automatically identify and analyze the quality of solder joints, improving inspection efficiency and accuracy.
Versatility : X-ray inspection is not only suitable for BGA chip solder joint inspection, but can also be used to detect the soldering quality, packaging integrity and internal structure defects of other electronic components. This makes X-ray inspection a versatile tool that can be applied to quality control and fault diagnosis of different types of electronic devices and components.
News
2024/01/09
